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PRODID:-//Microsoft Corporation//Outlook MIMEDIR//EN
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DTSTART:20101116T203000Z
DTEND:20101116T210000Z
LOCATION:393
DESCRIPTION;ENCODING=QUOTED-PRINTABLE:ABSTRACT: System-in-package (SiP) and 3D integration are promising technologies to bring more memory onto a microprocessor package to mitigate the ``memory wall'' problem. In this paper, instead of using them to build caches, we study a heterogenous main memory using both on- and off-package memories providing both fast and high-bandwidth on-package accesses and expandable and low-cost commodity off-package memory capacity.  We introduce another layer of address translation coupled with an on-chip memory controller that can dynamically migrate data between off-package and off-package memory either in hardware or with operating system assistance depending on the migration granularity.  Our experimental results demonstrate that such design can achieve the average effectiveness of 83% of the ideal case where all memory can be placed in high-speed on-package memory for our simulated benchmarks.
SUMMARY:Simple but Effective Heterogeneous Main Memory with On-Chip Memory Controller Support
PRIORITY:3
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